1. 2. 3. material content data sheet sales product name ipa50r199cp issued 29. august 2013 ma# MA000904224 package pg-to220-3-111 weight* 2241.64 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 8.809 0.39 0.39 3930 3930 leadframe non noble metal iron 7439-89-6 0.687 0.03 307 inorganic material phosphorus 7723-14-0 0.206 0.01 92 non noble metal copper 7440-50-8 686.221 30.61 30.65 306124 306523 wire non noble metal aluminium 7429-90-5 2.677 0.12 0.12 1194 1194 encapsulation organic material carbon black 1333-86-4 2.196 0.10 980 plastics epoxy resin - 206.410 9.21 92080 inorganic material silicondioxide 60676-86-0 889.319 39.67 48.98 396725 489786 leadfinish non noble metal tin 7440-31-5 7.942 0.35 0.35 3543 3543 plating non noble metal nickel 7440-02-0 0.305 0.01 136 inorganic material phosphorus 7723-14-0 0.001 0.00 0.01 1 136 solder non noble metal antimony 7440-36-0 0.420 0.02 187 noble metal silver 7440-22-4 1.049 0.05 468 non noble metal tin 7440-31-5 2.727 0.12 0.19 1217 1872 heatspreader inorganic material phosphorus 7723-14-0 0.130 0.01 58 non noble metal iron 7439-89-6 0.433 0.02 193 non noble metal copper 7440-50-8 432.110 19.28 19.31 192765 193016 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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